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A photoelastic study of the stress distribution in stiffened plating

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Published by Massachusetts Institute of Technology .
Written in English


  • Naval architecture

Book details:

Edition Notes

Thesis (NE)--Massachusetts Institute of Technology, 1955.

ID Numbers
Open LibraryOL24998390M

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Abstract. Photoelastic stress analysis is a full-field technique for measuring the magnitudes and directions of principal stresses. The technique has been used traditionally to study plane polymer models of structures (Frocht, a, b) by passing polarized light through transparent, loaded models and interpreting stress fields from the formation of interference by: PHOTOELASTIC METHOD FOR STRESS ANALYSIS B), C. Broniewska & M.S. Mitra. Ph. D., B. Met. Photoelasticity is an experimental method for two dimensional stress analysis which uses optical effect to determine mechanical stresses and their distribution. The discovery of photoelastic effect is credited to Sir David Brewster who published in The experiment was conducted to study the stress distribution on a homogeneous plastic using photoelastic analysis system where the stress was observed by reflection polariscope. The circular disk of homogeneous plastic was used for study in this research. The sample was pressed at the top and bottom. The fringe patterns were produced from sample on the model being stressed, which could be Author: Yongyut Manjit, Saksit Sukprasong, Apichart Limpichaipanit, Athipong Ngamjarurojana. Internal stress exists in electroplated and chemically applied metallic coatings. This paper reviews the test procedures for measuring deposit stress and the formulas used to calculate stress values. Many formulas used require modification to obtain actual internal stress values. Errors in this regard are examined and common mistakes are explained.

The Photoelastic Coating Method was applied to find the surface stresses on the cap of an electrical insulator. The strain distribution was observed and photographed. This color photograph indicated a visible geography of the maximum shear strain distribution in the region of the in­.   Stress distribution about a slowly growing crack determined by photoelastic-coating method. Test procedure is verified by determining that insufficient shear transfer through the plastic thickness resulted in errors less than 10 percent. William Gerberich 1Cited by: A repeatable experimental photoelastic model was developed to characterize the stress distribution generated by the insertion of a pedicle screw into a standard material. This technique is a valuable tool to compare the performance of pedicle screws of different designs and determine the influence of various implant features. Therefore, this in-vitro study was undertaken to compare stress distribution in a tooth restored with metal and fiber posts of varying diameters ( and mm) by means of three-dimensional FEA.

However, although photoelastic analysis provides good qualitative evaluation of tension distribution (e.g., critical stress points), it may not be a practical test for quantitative assessment. Photoelastic stress analysis. Lasers, LED’s, and advanced digital analysis have spurred the development of photoelastic stress analysis, which produces interference fringe patterns that uncover the effects of strains and stresses on glass, machinery, and other objects. The isochromatic pattern is related to the stress system by the stress-optic law. namely σσ12−= f t N () where f is the stress-optical coefficient, a constant that depends upon the model material and the wavelength of light employed4, t is the model thickness, and N is . ELSEVIER Materials Chemistry and Physics 51 () IR photoelasticity study of stress distribution in silicon under thin film structures S.P. Wong a,*, W.Y. Cheung a, N. Ke a, M.R. Sajan a, W.S. Guo a, L. Huang b, Shounan Zhao b a Departmwt of Elcrrronic Engineering rind Materink Technology Resenrch Cenrw, The Chinese lJniwtxi& of Hong Kong, Shaiin, New Terrirnrier, Hong Cited by: